Memory IC

SAMSUNG DDR4 DRAM Series: 4GB to 32GB Performance

Explore Samsung's DDR4 DRAM ICs, from 4GB to 32GB. High-speed, low-power, and compatible with various platforms. Ideal for servers, workstations, and more.

  • Model: DDR4
  • Type: DDR4 DRAM
  • Voltage: 1.2V
  • Electric current: /
  • Memory format: x8/x16
  • Storage: 4GB / 8GB / 16GB / 32GB
  • Operating temperature: 0°C ~ +85°C
  • Package/Case: BGA Package
  • Brand: SAMSUNG

Samsung DDR4 DRAM Chip Series Product Description

        The Samsung DDR4 DRAM chip series offers a wide range of capacities, from 4GB to 32GB, including models such as K4A4G085WF-BIWE (4GB), K4A8G085WG-BCWE (8GB), K4AAG165WC-BIWE (16GB), and K4ABG165WA-MCWE (32GB). These chips are manufactured using advanced processes, ensuring low power consumption and high-efficiency data transfer speeds. They not only represent a leap in performance but also offer excellent compatibility with mainstream motherboard platforms, making them easy to install and ready to use. Whether for home entertainment, small business servers, professional graphic workstations, or cloud service providers, these four different capacity DDR4 DRAMs provide a stable and reliable memory solution, significantly improving data processing speed and multitasking capabilities, meeting the demand for higher performance and larger capacity in modern computer systems.

Key Features of Samsung DDR4 DRAM Chip Series

  1. Low Power Consumption and High Efficiency

    • Advanced Process Technology: Samsung DDR4 DRAM chips utilize the latest semiconductor manufacturing processes, such as 10nm or more advanced nodes, which increase transistor density and reduce operating voltage and current requirements, thereby decreasing overall power consumption.

    • Energy Saving Modes: These DRAM chips support various energy-saving modes, including adaptive refresh rate adjustment, Temperature Compensated Self-Refresh (TCR), and Deep Power Down (DPD) mode, further reducing standby and operational energy use.

  2. High-Speed Data Transfer

    • Higher Frequencies: Compared to the previous generation DDR3, Samsung DDR4 DRAM supports higher working frequencies. The models mentioned can support frequencies up to 2400MHz and above, with some reaching 3200MHz or higher.

    • Optimized Data Bus: By employing a wider data bus and improved signal integrity design, these DRAM chips achieve faster read/write speeds, enhancing system responsiveness and processing power.

  3. Wide Compatibility

    • Multi-Platform Support: Designed with broad compatibility in mind, Samsung DDR4 DRAM chips support major motherboard platforms, including Intel and AMD processor architectures, suitable for desktops, laptops, and servers.

    • Standard Interface: All models comply with JEDEC standards, ensuring compatibility with other hardware devices that meet the same standards, simplifying installation and configuration.

  4. Superior Stability and Durability

    • Rigorous Testing Procedures: Each Samsung DDR4 DRAM chip undergoes stringent testing, including high-temperature aging tests, stress tests, and electrical characteristic tests, to ensure stability and reliability under various conditions.

    • High-Quality Materials: Using premium materials and advanced packaging technology, these DRAM chips exhibit excellent electromagnetic interference resistance and thermal management, maintaining stable operation under prolonged heavy loads.

    • Error Detection and Correction: Some high-end models support ECC (Error-Correcting Code) functionality, automatically detecting and correcting single-bit errors, further enhancing data integrity and system stability.

  5. Advanced Internal Architecture

    • Dual-Channel Architecture: Samsung DDR4 DRAM chips feature a dual-channel architecture, allowing simultaneous access to two independent data channels, effectively doubling data throughput.

    • Bank Grouping: By dividing memory cells into multiple Bank Groups, more efficient data access and scheduling are achieved, reducing latency and increasing concurrent processing capability.

  6. Easy Scalability and Upgradability

    • Modular Design: These DRAM chips are typically provided in DIMM (Dual In-line Memory Module) or SO-DIMM (Small Outline Dual In-line Memory Module) form factors, enabling users to easily add or replace memory sticks for quick capacity and performance upgrades.

    • Backward Compatibility: While DDR4 is a new standard, many motherboard designs consider backward compatibility, allowing users to gradually upgrade to DDR4 memory within their existing systems without the need for an immediate full platform replacement.

Applications of Samsung DDR4 DRAM Chip Series

  • DDR4 4GB DRAM for Home Entertainment Centers:Ideal for multimedia PCs used for enjoying HD movies and streaming content. It ensures smooth playback of 1080p or even 4K resolution videos and maintains system responsiveness during multitasking, while its low power consumption contributes to a more environmentally friendly setup.

  • DDR4 8GB DRAM for Small Business Servers:A cost-effective yet powerful solution for setting up a stable and efficient file server in a startup environment. It improves file access speed, reduces employee wait times, and optimizes the daily backup process, supporting business growth with ease.

  • DDR4 16GB DRAM for Professional Graphic Workstations:Provides ample memory space for handling large image datasets and complex rendering tasks, essential for graphic designers. It allows for the seamless opening of multiple large project files, accelerates graphics processing, and ensures reliability during long hours of work.

  • DDR4 32GB DRAM for Cloud Service Providers:As a standard configuration for next-generation servers, it significantly boosts computing power and service load capacity. The increased memory capacity enables running more virtual machine instances on a single physical host, enhancing resource utilization and lowering operational costs, while supporting the latest high-speed interface standards for rapid data transfer.


label: DRAM IC
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