FC-BO2D is a high-density organic packaging carrier board produced by TDK Company, which has high integration, excellent heat dissipation performance and high reliability.
FC-BO2D Product Description
FC-B02D power filter moduleis a high-performance power quality improvement device that significantly reduces Eliminates electromagnetic interference (EMI) and radio frequency interference (RFI) to ensure high quality of output current. The module is suitable for a wide voltage range, capable of handling AC input voltages of hundreds of volts, and has good temperature tolerance. Its compact design is easy to integrate into existing power systems and has low insertion loss characteristics, ensuring efficient filtering without affecting power efficiency. FC-B02D power filter module is an important choice to improve power supply stability and reliability in industrial automation, communication infrastructure, medical equipment and other fields.
FC-BO2D Product Features
1. High-efficiency filtering performance: Reduce electromagnetic interference (EMI) and radio frequency interference (RFI) to ensure the purity of the output current, thereby Improve overall system stability and reliability.
2. Widely applicable voltage range:Supports hundreds of volts of AC input voltage, can adapt to different types of power systems, and is suitable for many application scenarios.
3. Good temperature adaptability:Maintain efficient performance over a wide operating temperature range, even in extreme environments Ensures stable work and is suitable for different geographical and climatic conditions.
4. Compact design:Compact design, easy to install and integrate into existing power systems, saving space, especially suitable for limited space application scenarios.
5. Low insertion loss: High-efficiency filtering is performed without affecting the power efficiency to ensure that the overall energy efficiency of the power system is not affected. , reduce energy consumption.
6. Improve system stability: By reducing noise and interference in the power supply, improve the stability and service life of downstream equipment and reduce Maintenance costs and failure rates.
7. Flexibility: Suitable for industrial automation, communication infrastructure, medical equipment and other fields to meet the power quality requirements of different industries requirements.
FC-BO2D Product Application
1. ASIC for high-end servers, network routers/converters:Among these devices, FC-BO2D It can meet the requirements of high-end flip-chip LSI and realize high-quality and high-performance additive structure loading board. For example, it can be used to package high-performance processors and memory chips, providing high-speed and efficient data processing and transmission capabilities to meet the high-performance needs of servers and network equipment.
2. MPU for high-performance game consoles: In game consoles, FC-BO2D can provide I The number of /O pins exceeds 3000, meeting the needs of high-performance game consoles. For example, it can be used to package high-performance graphics processors and audio processors, provide high-definition, smooth game graphics and sound effects, and enhance the gaming experience.
3. High-performance ASSP, FPGA, graphics process, etc.: FC-BO2D Applicable Suitable for many types of chips, it is commonly used in high-performance chips such as CPUs, microcontrollers, and GPUs. It is also suitable for network chips, communication chips, memory chips, digital signal processors (DSP), sensors, audio processors, etc. For example, it can be used to package high-performance communication chips, provide high-speed and efficient data communication capabilities, and meet the high-performance needs of communication equipment.
