GDDR6 DRAM Chip Series Product Description
The H56G32CS4DX005 and H56G42AS4DX014 launched by Hynix are two high-performance GDDR6 DRAM chips, providing storage capacities of 16GB and 32GB respectively. Both chips support 16Gbps data transfer rate, ensuring fast and stable data exchange capabilities. The operating voltage is 1.35V, which significantly reduces power consumption and improves energy efficiency. Using FBGA 190-ball packaging technology, the density and heat dissipation performance are improved to ensure stable operation for a long time. Supports multiple energy-saving modes, such as automatic refresh rate adjustment and deep power-saving mode, to further reduce energy consumption. H56G32CS4DX005 and H56G42AS4DX014 are ideal for high-performance computing and graphics processing applications due to their high bandwidth, low power consumption, high density and stability.
GDDR6 DRAM Chip Series Product Features
H56G32CS4DX005 Product Features
H56G32CS4DX005 is a16GB GDDR6 launched by Hynix DRAM chipsdesigned for high-performance computing and graphics processing applications. This chip supports data transmission rates up to 16Gbps, ensuring fast and stable data exchange capabilities. Its working voltage is 1.35V, which significantly reduces power consumption and improves energy efficiency ratio. H56G32CS4DX005 adopts FBGA 190-ball packaging technology, which not only increases density but also enhances heat dissipation performance to ensure stability and reliability during long-term operation. In addition, the chip supports a variety of energy-saving modes, such as automatic refresh rate adjustment and deep power-saving mode, which further reduces energy consumption during standby and operation. These features make theH56G32CS4DX005 ideal for high-end graphics cards, gaming consoles, and professional workstations.
H56G42AS4DX014 Product Features
  ; H56G42AS4DX014 is another high-performance GDDR6 DRAM chip from Hynix, providing 32GB of storage capacity, twice that of H56G32CS4DX005, suitable for Application scenarios that require larger memory space. This chip also supports a data transmission rate of 16Gbps, ensuring fast data processing capabilities. The operating voltage is 1.35V and the low power consumption design makes it perform well in high-performance computing and graphics processing. H56G42AS4DX014 Adopts FBGA 190-ball packaging technology, providing high density and good heat dissipation performance, suitable for compact designs. In addition, the chip supports a variety of energy-saving modes, such as temperature-compensated self-refresh and deep power-saving mode, further improving the energy efficiency ratio. These features makeH56G42AS4DX014 an ideal choice for environments with extremely high requirements on data processing capabilities, such as data centers and artificial intelligence computing platforms.
GDDR6 DRAM chip seriesProducts Parameters
1. High Bandwidth
•Data transmission Rate: BothH56G32CS4DX005andH56G42AS4DX014support data transfer rates up to 16Gbps, ensuring fast data exchange capabilities and are particularly suitable for applications requiring large amounts of data processing.
•Bandwidth:16GB and 32GB GDDR6 chips provide 512GB/s and 1024GB/s bandwidth respectively, meeting high Performance computing and graphics processing needs.
2. Low Power Consumption
•Working voltage:1.35V The working voltage significantly reduces power consumption and improves energy efficiency compared with previous generation products.
And deep power saving mode (DPD) to further reduce energy consumption during standby and operation.
3. High Density
•Capacity options:16GB and 32GB Capacity options meet the memory size requirements of different application scenarios, especially in the high-end graphics card and server markets.
4. Stability
•Error detection and correction:Built-in errors Detection and correction functions reduce data errors and improve system reliability and stability.
•Temperature range: A wide temperature range of -40°C to +125°C ensures durability in extreme environments stable operation.
GDDR6 DRAM Chip Series Product Applications
H56G32CS4DX005 Product Application
High-end gaming graphics card:A well-known graphics card manufacturer uses HynixH56G32CS4DX005 GDDR6 DRAM in its latest flagship graphics card Chip. This graphics card is designed for high-end gamers and professional designers who need to process large amounts of graphics data and complex algorithms. H56G32CS4DX005 The 16GB storage capacity and 16Gbps data transfer rate ensure the high performance of the graphics card when running large games and rendering complex graphics. In addition, the 1.35V operating voltage and multiple energy-saving modes effectively reduce power consumption and extend the service life of the graphics card. User feedback shows that this graphics card performs well at high resolution and high frame rate, the game screen is smooth and without delay, and the professional design software runs stably, which greatly improves the user experience.
H56G42AS4DX014 Product Application
Data center and artificial intelligence computing platform: A large data center uses Hynix in its high-performance computing platformH56G42AS4DX014 GDDR6 DRAM chip. The 32GB storage capacity and 16Gbps data transmission rate provided by this chip meet the needs of data centers for large-scale data processing and storage. The high bandwidth and low power consumption of H56G42AS4DX014 enable data centers to achieve efficient parallel computing and rapid data exchange when performing large-scale data analysis, machine learning and deep learning tasks. In addition, FBGA 190 ball packaging technology and multiple energy-saving modes ensure the stability and energy efficiency of the chip under high loads. In practical applications, the computing performance and energy efficiency of the data center have been significantly improved, customer satisfaction has been greatly improved, and business operations have become smoother.
