SK hynix launched the GDDR7 DRAM chip with 32Gbps speed, 50% better efficiency, and 74% lower thermal resistance, ideal for AI, HPC, and autonomous driving.
2024/10/11
SK Hynix launches 12L HBM3E DRAM mass production, setting new global benchmarks for speed, capacity, and stability, strengthening AI memory leadership.
2024/10/09
Samsung's HBM3E 12H 24GB DRAM chip, stacking 12 layers of 24Gb DRAM, offers 36GB total capacity, 9.8Gbps data rate, and 1,250GB/s bandwidth with optimized thermal and power efficiency.
2024/10/07
Discover STMicro's TSB952 dual op-amp: 52MHz bandwidth, 3.3mA low power, rail-to-rail output, 4.5V-36V supply, -40°C to 125°C operation, 4kV ESD protection, in compact 3x3mm DFN8/SO8.
2024/07/04
i.MX RT1180 MCU, industrial-grade, real-time communication, TSN switch, EdgeLock® secure, system-level safety, automotive, Ethernet TSN connectivity.
2024/07/02
STMicroelectronics, a world-leading semiconductor supplier, announced the launch of the ultra-low-power STM32U0 microcontroller: STMicroelectronics leads a new era of energy saving for smart devices.
2024/05/23
Samsung begins mass production of 9th gen 1Tb TLC V-NAND, featuring a 50% bit density boost, dual-stack design, channel hole etching, 10% less energy use, and Toggle 5.1 interface for green, high-performance storage.
2024/04/20
Explore advanced processors, sensors, and power switches for industrial applications. Enhance performance and efficiency in harsh environments.
2023/05/29
