SAMSUNG K3LKBKB0BM-MGCP LPDDR5 32GB chip provides ultra-fast 6400Mbps data transfer speed, comes in a BGA package, and has strong temperature adaptability, operating in a temperature range of -25°C to 85°C.
Samsung K4UBE3D4AM-THCL LPDDR4X memory, 4266Mbps high-speed transmission, low power consumption, 32Gb large capacity, extensive temperature control, BGA packaging, suitable for high-end mobile phones, tablets and wearable devices.
Samsung's LPDDR4 16GB K4AAG165WA-BCWE memory is manufactured using a 10nm process and runs at 3200Mbps. Tailored for high-end smart devices, it features large capacity, low power consumption, and fast performance.
32-bit MCU-STM32F405VGT6 ARM Cortex-M4+FPU, 168MHz high-speed processor, 1MB Flash/192KB RAM. Suitable for industrial automation, smart instruments, and high-end robots.
15038PB-B0L-EP AC axial fan with ball bearing design, efficient, reliable operation and thermal overload protector. Suitable for office automation equipment.
FC-BO2D is a high-density organic packaging carrier board produced by TDK Company, which has high integration, excellent heat dissipation performance and high reliability.
The 6DI150A-060 IGBT module has high efficiency, low noise, and low THD characteristics, and can provide precise power control, excellent performance, and stable and reliable power supply.
6SL3351-3AE41-0DA0 inverter power module, the casing is made of aluminum alloy, the internal structure includes a power block, inverter module, air cooling system and safety integrated functions.
