The SK Hynix LPDDR5T H58G76BV9HX095 is a high-performance DRAM chip with a capacity of 16Gb, providing a data transfer speed of 9600Mbps and is designed for low power consumption in high-end mobile devices, thereby improving their performance.
K3KL1L10GM-JGCT Product Description:SamsungK3KL1L10GM-JGCT LPDDR5X memory chip Capacity, tailored for high-end mobile and edge computing devices that pursue ultimate speed and energy efficiency. Adopt
SAMSUNG K3LKBKB0BM-MGCP LPDDR5 32GB chip provides ultra-fast 6400Mbps data transfer speed, comes in a BGA package, and has strong temperature adaptability, operating in a temperature range of -25°C to 85°C.
Samsung K4UBE3D4AM-THCL LPDDR4X memory, 4266Mbps high-speed transmission, low power consumption, 32Gb large capacity, extensive temperature control, BGA packaging, suitable for high-end mobile phones, tablets and wearable devices.
Samsung's LPDDR4 16GB K4AAG165WA-BCWE memory is manufactured using a 10nm process and runs at 3200Mbps. Tailored for high-end smart devices, it features large capacity, low power consumption, and fast performance.
32-bit MCU-STM32F405VGT6 ARM Cortex-M4+FPU, 168MHz high-speed processor, 1MB Flash/192KB RAM. Suitable for industrial automation, smart instruments, and high-end robots.
15038PB-B0L-EP AC axial fan with ball bearing design, efficient, reliable operation and thermal overload protector. Suitable for office automation equipment.
FC-BO2D is a high-density organic packaging carrier board produced by TDK Company, which has high integration, excellent heat dissipation performance and high reliability.
